RF & microwave laboratory
Network and signal analysis, measurement and calibration on Anritsu instruments: amplifiers, filters, antennas and complete RF chains characterised in house.
Engineering & manufacturing
Most companies buy technology.
We build it.
Five layers, one team, one roof. When one company owns every layer, it moves faster, guarantees its supply and adapts to each mission, without asking anyone's permission.
- 05
Spectral AI™ & AI software
Spectral AI: fusion, classification and decision support, trained by us.
- 04
Research & embedded engineering
Research and development in house: real-time DSP and firmware, with our signal-processing maths running in FPGA cores, verified bit-exact against software.
- 03
Manufacturing
Surface-mount lines, reflow, laser prototyping, packaging and test, in our own European facility. No queue at an outside fab.
- 02
Electronics
RF, mixed-signal and power. GaN amplifiers, wideband radios, multilayer boards, inspected and tested in house.
- 01
Silicon
Our own data converters and front ends, probed on the wafer and packaged in our own clean rooms. The layer almost nobody in Europe owns.
How we engineer
From an idea
to a product.
- 01
Concept
Requirements, architecture and feasibility, with the customer.
- 02
Simulation
Circuit, electromagnetic and thermal simulation before anything is built.
- 03
Design
Schematics, multilayer layout, firmware, FPGA cores and mechanics.
- 04
Prototype
Boards assembled and modules built in house, in days.
- 05
Debug & test
Measured on calibrated instruments; every result stored with its project.
- 06
Production
Controlled assembly, traceability and acceptance testing, ISO 9001.
Facilities
What our building
lets us do.
Manufacturing, laboratories and design in one European facility, so a design becomes measured hardware in days, not months. Semiconductor fabrication is in preparation.
Anechoic chamber
Radiated measurements and antenna patterns, and direction-finding calibration, without renting outside test time.
Clean rooms
Controlled environments for microelectronics assembly and for packaging our own chips.
Electronics assembly
Solder-paste printing, pick-and-place and reflow: from a bare board to a populated module under one roof.
Component logistics
Automated, traceable component storage that keeps every board linked to its project and its parts.
Test & qualification
Functional, thermal and environmental test of modules and systems before they leave the building.
In preparation
Semiconductor fabrication
Transistor and integrated-circuit processes in our own building, from today's design and packaging towards our own European fab.
R&D
Research &
development.
Research & development
R&D, in house
Our engineers design, simulate, build and measure in the same building: RF and microwave, mixed-signal, embedded systems and AI. Every result is measured on calibrated instruments before it becomes a product.
- Disciplines
- RF & microwave · power · mixed-signal · embedded · AI
- Measurement
- Calibrated network and signal analysis in our own labs
- Active programmes
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- Partners
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How we work
The speed of a startup.
The depth of a prime.
01 · Boutique
Small by design.
A compact team of engineers, AI agents and connected machines. No silos, no hand-offs that cost a week. Every system is built for the mission it serves, and the people who designed it answer your call.
02 · Deep tech
Physics first.
Direct-RF sampling, our own converters, signal processing in silicon, AI that knows the limits of the receiver it runs on. We measure before we claim.
03 · Sovereign
Ours, end to end.
Designed, owned and built in Europe. European design, European know-how, no licensed-in core. Built to stay under European control.
04 · Discreet
Need to know.
We work with governments, armed forces and operators of critical infrastructure. What we build for them stays between us.